印制电路板是现代电子产品中不可或缺的组成部分，而增强基材是印制电路板的重要组成部分之一。增强基材的质量直接影响到印制电路板的性能和可靠性。IEC 61249-2-12:1999 标准规定了一种增强基材，即无纺布芳纶层压板，铜覆盖的印制电路板材料。
该标准规定了该材料的物理、机械、电气和防火性能等方面的要求。其中，物理性能包括板材的厚度、密度、吸水率、热膨胀系数等；机械性能包括板材的弯曲强度、拉伸强度、剪切强度等；电气性能包括板材的介电常数、介质损耗因子、表面电阻等；防火性能包括板材的燃烧性能、烟气毒性等。
此外，该标准还规定了板材的铜覆盖层的厚度、附着力、耐蚀性等要求。铜覆盖层的质量直接影响到印制电路板的导电性能和可靠性。
IEC 61249-2-12:1999 标准规定了该材料的防火性能要符合UL 94 V-0级别。UL 94是美国安全实验室（Underwriters Laboratories）制定的关于塑料材料燃烧性能的测试标准，V-0级别是最高级别，表示材料在火焰作用下燃烧时间不超过10秒钟，且火焰自行熄灭，不会滴落燃烧物。
该标准的实施可以保证印制电路板材料的质量和可靠性，提高电子产品的性能和安全性。
相关标准
- IEC 61249-2-21:1999 Materials for printed boards and other interconnecting structures - Part 2-21: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-22:1999 Materials for printed boards and other interconnecting structures - Part 2-22: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (vertical burning test), non-copper-clad
- IEC 61249-2-23:1999 Materials for printed boards and other interconnecting structures - Part 2-23: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (horizontal burning test), copper-clad
- IEC 61249-2-24:1999 Materials for printed boards and other interconnecting structures - Part 2-24: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (horizontal burning test), non-copper-clad
- IEC 61249-2-25:1999 Materials for printed boards and other interconnecting structures - Part 2-25: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven aramid reinforced laminate of defined flammability (vertical burning test), copper-clad