氰酸酯非织造芳纶层压板是一种高性能的增强基材，具有优异的机械性能和耐高温性能。它由氰酸酯树脂和芳纶纤维组成，经过层压加工而成。该材料的优点在于其高强度、高刚度、低热膨胀系数和优异的耐高温性能。因此，它被广泛应用于高速电子设备、航空航天和国防等领域。

本标准规定了氰酸酯非织造芳纶层压板的可燃性要求。该材料的可燃性是指其在火焰下的燃烧性能。本标准规定了该材料的可燃性等级为V-0级，即在一定的实验条件下，该材料的燃烧时间不超过10秒，并且不会滴落燃烧物。

此外，本标准还规定了氰酸酯非织造芳纶层压板的铜覆盖要求。铜覆盖是指在氰酸酯非织造芳纶层压板表面镀覆一层铜，以便于印制电路板的制造。本标准规定了铜覆盖的厚度、附着力、耐蚀性和表面处理等要求。

总之，IEC 61249-2-13:1999标准规定了氰酸酯非织造芳纶层压板的可燃性和铜覆盖的要求，为印制电路板和其他互连结构材料的制造提供了重要的参考依据。

相关标准
- IEC 61249-2-21:1999 Materials for printed boards and other interconnecting structures - Part 2-21: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-22:1999 Materials for printed boards and other interconnecting structures - Part 2-22: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven aramid reinforced laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-23:1999 Materials for printed boards and other interconnecting structures - Part 2-23: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven glass mat reinforced laminate of defined flammability (vertical burning test), non-copper-clad
- IEC 61249-2-24:1999 Materials for printed boards and other interconnecting structures - Part 2-24: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven aramid reinforced laminate of defined flammability (vertical burning test), non-copper-clad
- IEC 61249-2-25:1999 Materials for printed boards and other interconnecting structures - Part 2-25: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide woven glass fabric reinforced laminate of defined flammability (vertical burning test), copper-clad