氰酸酯非织造芳纶层压板是一种高性能材料，具有优异的机械性能、热稳定性和化学稳定性。它通常用于高速、高频和高温应用，如雷达、卫星通信、航空航天等领域。本标准规定了一种氰酸酯非织造芳纶层压板，其铜覆盖层的可燃性已经定义。

该标准规定了氰酸酯非织造芳纶层压板的物理、机械、电气和化学性能要求，包括厚度、密度、弯曲强度、拉伸强度、介电常数、介电损耗、表面电阻、体积电阻、耐热性、耐化学性等。此外，本标准还规定了氰酸酯非织造芳纶层压板的铜覆盖层的可燃性要求，包括燃烧时间、燃烧长度、燃烧后残留物等。

本标准的实施可以保证氰酸酯非织造芳纶层压板的质量和性能，有助于提高电子设备和系统的可靠性和稳定性。同时，本标准还可以促进国际贸易和技术交流，为电子行业的发展做出贡献。

相关标准
- IEC 61249-2-1:1999 Materials for printed boards and other interconnecting structures - Part 2-1: Sectional specification set for reinforced base materials, clad and unclad - Epoxide woven E-glass laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-2:1999 Materials for printed boards and other interconnecting structures - Part 2-2: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven E-glass laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-3:1999 Materials for printed boards and other interconnecting structures - Part 2-3: Sectional specification set for reinforced base materials, clad and unclad - Modified epoxy non-woven E-glass laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-4:1999 Materials for printed boards and other interconnecting structures - Part 2-4: Sectional specification set for reinforced base materials, clad and unclad - Polyimide woven E-glass laminate of defined flammability (vertical burning test), copper-clad
- IEC 61249-2-5:1999 Materials for printed boards and other interconnecting structures - Part 2-5: Sectional specification set for reinforced base materials, clad and unclad - Polyimide non-woven aramid laminate of defined flammability (vertical burning test), copper-clad