印制电路板是现代电子设备中不可或缺的组成部分。增强基材是印制电路板的重要组成部分之一，它为电路板提供了机械强度和稳定性。玻璃纤维增强环氧树脂层压板是一种常用的增强基材，其具有优异的机械性能和耐热性能。然而，在某些应用场合，如航空航天、军事等领域，对印制电路板的防火性能有更高的要求。因此，IEC 61249-2-19:2001 标准规定了一种玻璃纤维增强环氧树脂层压板，其防火性能符合垂直燃烧测试的要求。

该标准规定了玻璃纤维增强环氧树脂层压板的制造工艺、物理性能、化学性能和防火性能等方面的要求。其中，防火性能是该标准的重点内容。玻璃纤维增强环氧树脂层压板的防火性能是通过垂直燃烧测试来评估的。该测试要求将样品垂直放置在燃烧器中，点燃样品的下端，然后记录样品的燃烧时间和燃烧高度。根据测试结果，可以评估样品的防火性能等级。

除了防火性能外，该标准还规定了玻璃纤维增强环氧树脂层压板的铜覆盖要求。铜覆盖是印制电路板中的一项重要工艺，它为电路板提供了导电性能。该标准规定了铜覆盖的厚度、附着力、耐蚀性等方面的要求。

总之，IEC 61249-2-19:2001 标准规定了一种玻璃纤维增强环氧树脂层压板，其防火性能符合垂直燃烧测试的要求，并规定了铜覆盖的要求。该标准的制定为印制电路板的应用提供了更高的安全性和可靠性保障。

相关标准
- IEC 61249-2-1:1993 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - General requirements and test methods
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly, high Tg
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly, high Tg, high Td
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly, high Tg, high Td, high T288