该标准主要针对球柱端子封装的设计进行规范，旨在提高半导体器件的可靠性和互换性。标准规定了封装的外形尺寸、引脚排列、引脚数量、引脚位置、引脚形状等方面的要求。此外，标准还规定了封装的材料、焊盘、引脚的镀层、引脚的高度、引脚的间距等方面的要求。

在设计球柱端子封装时，应根据器件的特性和应用需求选择合适的封装类型和尺寸。标准中规定了三种间距的封装，分别为1.50毫米、1.27毫米和1.00毫米。其中，1.50毫米间距的封装适用于高功率器件，1.27毫米间距的封装适用于中等功率器件，1.00毫米间距的封装适用于低功率器件。

标准还规定了球柱端子封装的焊盘和引脚的镀层要求。焊盘和引脚的镀层应具有良好的焊接性能和耐腐蚀性能。常用的镀层材料有金、银、锡、铜等。此外，标准还规定了引脚的高度和间距要求，以确保封装的互换性和可靠性。

总之，IEC 60191-6-2:2001/COR1:2002 标准为半导体器件的表面贴装封装提供了重要的机械标准化指南，有助于提高器件的可靠性和互换性，促进半导体器件的发展和应用。

相关标准
- IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for leadless package outlines
- IEC 60191-6-3:2001 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (LGA) packages
- IEC 60191-6-4:2001 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for small outline transistor (SOT) packages
- IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) packages
- IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for dual flat no-lead (DFN) packages