IEC 61249-4-12:2005 标准规定了一种非卤素多功能环氧树脂预浸料，用于制造印制电路板和其他互连结构。该预浸料采用玻璃纤维作为增强材料，具有良好的机械性能和耐热性能。同时，该预浸料不含卤素，符合环保要求。

该标准规定了预浸料的物理、化学和电气性能，包括导热系数、介电常数、耐热性、耐湿性、耐化学性等。此外，该标准还规定了预浸料的可燃性要求，包括垂直燃烧测试、水平燃烧测试等。

预浸料的垂直燃烧测试要求其燃烧速率不超过50mm/min，燃烧时间不超过30s。水平燃烧测试要求其燃烧速率不超过75mm/min，燃烧时间不超过30s。这些要求保证了预浸料在使用过程中的安全性。

该标准还规定了预浸料的外观要求，包括表面平整度、无气泡、无裂纹等。这些要求保证了预浸料在制造印制电路板和其他互连结构时的可靠性和稳定性。

总之，IEC 61249-4-12:2005 标准规定了一种非卤素多功能环氧树脂预浸料，具有良好的机械性能和耐热性能，同时符合环保要求。该标准规定了预浸料的物理、化学和电气性能，以及其可燃性等特性，保证了预浸料在使用过程中的安全性和可靠性。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,15 W/(m·K) or less
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 0,15 W/(m·K) but less than or equal to 0,35 W/(m·K)
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 0,35 W/(m·K) but less than or equal to 0,50 W/(m·K)
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 0,50 W/(m·K) but less than or equal to 0,70 W/(m·K)
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 0,70 W/(m·K)