IEC 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
发布时间：2006-08-29 实施时间：


IEC 61189-5:2006标准主要包括以下内容：

1. 术语和定义：该部分定义了与印制板组件测试相关的术语和定义，以便在标准中使用时能够统一理解。

2. 测试方法：该部分规定了印制板组件的测试方法，包括电气测试、机械测试、环境测试和可靠性测试等。其中，电气测试包括电阻测试、电容测试、电感测试、电压测试、电流测试、功率测试、信号完整性测试等；机械测试包括弯曲测试、扭曲测试、拉伸测试、压缩测试等；环境测试包括温度测试、湿度测试、盐雾测试、震动测试等；可靠性测试包括寿命测试、可靠性评估等。

3. 测试设备和仪器：该部分规定了印制板组件测试所需的设备和仪器，包括测试仪器、测试设备、测试夹具等。

4. 测试程序：该部分规定了印制板组件测试的程序，包括测试前的准备工作、测试过程中的操作流程、测试后的数据处理等。

5. 测试结果的评估和分析：该部分规定了印制板组件测试结果的评估和分析方法，包括数据处理、结果分析、问题诊断等。

6. 报告：该部分规定了印制板组件测试报告的内容和格式，包括测试结果、测试数据、测试过程、测试设备等。

IEC 61189-5:2006标准的实施可以有效提高印制板组件的质量和可靠性，保证印制板组件在设计、制造和使用过程中的稳定性和可靠性。该标准适用于印制板组件的制造商、设计师、测试人员和使用者等。

相关标准
- IEC 61189-3-1:2002 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-1: Test methods for materials for interconnection structures - Sectional specification for unreinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of thermal conductivity 1,0 W/(m.K) or less
- IEC 61189-3-2:2002 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-2: Test methods for materials for interconnection structures - Sectional specification for unreinforced base materials, clad and unclad - Epoxide non-woven E-glass laminated sheet of thermal conductivity 1,0 W/(m.K) or less
- IEC 61189-3-3:2002 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-3: Test methods for materials for interconnection structures - Sectional specification for unreinforced base materials, clad and unclad - Modified epoxy non-woven E-glass laminated sheet of thermal conductivity 1,0 W/(m.K) or less
- IEC 61189-3-4:2002 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-4: Test methods for materials for interconnection structures - Sectional specification for unreinforced base materials, clad and unclad - Non-halogenated epoxide non-woven E-glass laminated sheet of thermal conductivity 1,0 W/(m.K) or less
- IEC 61189-3-5:2002 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-5: Test methods for materials for interconnection structures - Sectional specification for unreinforced base materials, clad and unclad - Non-halogenated modified epoxy non-woven E-glass laminated sheet of thermal conductivity 1,0 W/(m.K) or less