印制电路板是现代电子产品中不可或缺的组成部分，而预浸料则是印制电路板制造中的重要材料之一。预浸料是一种未固化的树脂基材料，用于制造多层印制电路板中的层间绝缘层。IEC 61249-4-1:2008 标准规定了一种特定的预浸料材料，即环氧树脂玻璃纤维预浸料。

该标准规定了环氧树脂玻璃纤维预浸料的物理、化学和机械性能要求，包括导热性能、介电常数、拉伸强度、弯曲强度、热膨胀系数等。此外，该标准还规定了预浸料的防火性能要求，包括燃烧性能、烟雾密度和毒性等级。这些要求旨在确保预浸料在印制电路板制造过程中的安全性和可靠性。

IEC 61249-4-1:2008 标准还规定了环氧树脂玻璃纤维预浸料的试验方法，包括热分解温度、玻璃化转变温度、燃烧性能、烟雾密度和毒性等级的测试方法。这些试验方法旨在确保预浸料的性能符合标准要求，并为制造商提供可靠的质量控制手段。

总之，IEC 61249-4-1:2008 标准为印制电路板制造中使用的预浸料材料提供了明确的要求和试验方法，有助于确保预浸料的安全性、可靠性和一致性。

相关标准
- IEC 61249-2-21:2008 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/m·K or less
- IEC 61249-2-22:2008 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K
- IEC 61249-2-23:2008 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K with a Tg greater than 130 °C
- IEC 61249-2-24:2008 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K with a Tg greater than 150 °C
- IEC 61249-2-25:2008 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K with a Tg greater than 170 °C