IEC 61249-2-37:2008
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间:2008-11-27 实施时间:


IEC 61249-2-37:2008 标准规定了一种用于印制电路板和其他互连结构的增强基材,包括铜覆盖的非卤素环氧树脂编织E玻璃层压板。该材料具有良好的机械性能和耐热性能,适用于高密度印制电路板和其他高性能互连结构的制造。

该标准还规定了该材料的垂直燃烧测试的定义可燃性等级。垂直燃烧测试是一种评估材料燃烧性能的测试方法,该测试方法模拟了材料在垂直方向上的燃烧情况。该标准规定了该材料的可燃性等级为V-0,即该材料在垂直燃烧测试中不会产生滴落物,且燃烧时间不超过10秒。

此外,该标准还规定了该材料的无铅组装性能。无铅组装是一种环保的组装方式,可以减少对环境的污染。该标准规定了该材料的无铅组装性能符合要求,可以用于无铅组装的印制电路板和其他互连结构的制造。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for leaded assembly
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), non-copper-clad for lead-free assembly
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), non-copper-clad for leaded assembly
- IEC 61249-2-36:2008 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad, for lead-free assembly of multilayer printed boards