IEC 61249-2-36:2008
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间:2008-11-27 实施时间:


IEC 61249-2-36:2008 标准规定了一种玻璃纤维层压板,用于制造印制电路板和其他互连结构。该标准适用于垂直燃烧测试,并且是铜覆盖的,适用于无铅组装。

该标准要求玻璃纤维层压板必须符合垂直燃烧测试的要求。垂直燃烧测试是一种测试材料在火焰下的燃烧性能的测试方法。该测试方法是通过将材料垂直放置在火焰下,然后观察材料的燃烧情况来进行的。该测试方法可以评估材料的燃烧性能,以确定其是否适合用于印制电路板和其他互连结构。

此外,该标准还要求玻璃纤维层压板必须是铜覆盖的,以适用于无铅组装。无铅组装是一种用于制造印制电路板的技术,它使用不含铅的焊料来连接电子元件和电路板。这种技术比传统的含铅焊料更环保,因为铅是一种有毒的金属,对环境和人类健康有害。

IEC 61249-2-36:2008 标准规定了玻璃纤维层压板的物理和机械性能要求,包括弯曲强度、拉伸强度、剪切强度、压缩强度、热膨胀系数等。这些性能要求可以确保玻璃纤维层压板具有足够的强度和稳定性,以满足印制电路板和其他互连结构的要求。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less, copper-clad for lead-free assembly
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K), copper-clad for lead-free assembly
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less, copper-clad for high-speed/high-frequency applications