IEC 61249-4-17:2009 标准是印制电路板制造过程中必不可少的一部分。预浸料是印制电路板制造中的重要材料之一，它是一种含有树脂和玻璃纤维的复合材料，用于制造多层板。预浸料的质量直接影响到印制电路板的性能和可靠性。

该标准规定了非卤素环氧树脂预浸料的垂直燃烧测试方法和要求。垂直燃烧测试是评估材料可燃性的一种方法，该测试模拟了材料在火灾中的燃烧情况。该标准要求预浸料在垂直燃烧测试中的燃烧速率不得超过指定的限制，并且要求预浸料在燃烧过程中不得产生有毒气体和有害物质。

该标准的要求适用于无铅组装的印制电路板和其他互连结构。无铅组装是一种环保的组装方式，它使用不含铅的焊料，减少了对环境的污染和对人体健康的危害。

总之，IEC 61249-4-17:2009 标准规定了非卤素环氧树脂预浸料的垂直燃烧测试方法和要求，适用于无铅组装的印制电路板和其他互连结构。该标准的实施有助于提高印制电路板的质量和可靠性，保护环境和人类健康。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for lead-free assembly
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) for lead-free assembly
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less with improved thermal decomposition for lead-free assembly
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) with improved thermal decomposition for lead-free assembly
- IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide non-woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly