IEC 61249-4-14:2009 标准是印制电路板制造过程中必不可少的一部分。该标准规定了预浸料材料的要求，以确保印制电路板的质量和可靠性。预浸料是一种在制造印制电路板时使用的材料，它是一种浸渍了树脂的玻璃纤维布。预浸料在制造印制电路板时起到了很重要的作用，因为它们是制造多层板的关键材料之一。

IEC 61249-4-14:2009 标准规定了一种特定的预浸料材料，即环氧树脂编织 E-玻璃预浸料。该预浸料材料必须符合垂直燃烧测试的要求，以确保其可燃性符合标准。此外，该标准还规定了预浸料的物理和化学性质，如厚度、重量、含水量、硬度、拉伸强度等。

该标准适用于无铅组装，这是因为无铅组装需要使用高温焊接，而预浸料材料必须能够承受高温。因此，该标准还规定了预浸料材料的热稳定性和热分解温度。

IEC 61249-4-14:2009 标准的实施可以确保印制电路板的质量和可靠性。该标准的要求可以帮助制造商选择合适的预浸料材料，并确保其符合标准要求。此外，该标准还可以帮助用户选择合适的印制电路板，以确保其符合其特定应用的要求。

相关标准
- IEC 61249-1-4:2006 Materials for printed boards and other interconnecting structures - Part 1-4: General requirements for printed board and other interconnecting structures materials - Reinforced base materials clad and unclad - Epoxide woven E-glass reinforced base materials
- IEC 61249-2-21:2006 Materials for printed boards and other interconnecting structures - Part 2-21: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced base materials
- IEC 61249-2-22:2006 Materials for printed boards and other interconnecting structures - Part 2-22: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced base materials
- IEC 61249-2-23:2006 Materials for printed boards and other interconnecting structures - Part 2-23: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide glass fabric reinforced base materials
- IEC 61249-2-24:2006 Materials for printed boards and other interconnecting structures - Part 2-24: Sectional specification set for reinforced base materials, clad and unclad - Non-halogenated epoxide glass mat reinforced base materials