IEC 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
发布时间：2009-05-26 实施时间：


IEC 61249-4-15:2009 标准是印制电路板制造过程中必不可少的一部分。预浸料是印制电路板制造中的重要材料之一，它是一种未经固化的树脂，用于在制造过程中将电路板的各个层次粘合在一起。预浸料的质量直接影响到印制电路板的性能和可靠性。

该标准规定了一种具有定义的防火性能（垂直燃烧测试）的多功能环氧树脂编织E玻璃预浸料，适用于无铅组装。这种预浸料具有良好的机械性能、热稳定性和化学稳定性，可以满足高密度、高速、高频和高可靠性的印制电路板制造要求。

该标准要求预浸料必须符合一系列物理、化学和电气性能指标，包括导电性、介电常数、介电损耗、热膨胀系数、剪切强度、拉伸强度、弯曲强度、燃烧性能等。此外，该标准还规定了预浸料的外观、尺寸、重量、包装和标识等要求。

在印制电路板制造过程中，预浸料的选择和使用非常重要。正确选择预浸料可以提高印制电路板的性能和可靠性，同时也可以降低制造成本。因此，印制电路板制造企业应该严格按照该标准的要求选择和使用预浸料，以确保印制电路板的质量和可靠性。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less, woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less, and non-halogenated epoxide woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K), woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K), and non-halogenated epoxide woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)