IEC 61249-4-16:2009 标准是印制电路板制造过程中必不可少的一部分。预浸料是印制电路板制造中的重要材料之一，它是一种含有树脂和增强材料的半成品材料，用于制造多层板。预浸料的质量直接影响到印制电路板的性能和可靠性。

该标准规定了一种具有定义的防火性能（垂直燃烧测试）的多功能非卤素环氧树脂编织E玻璃预浸料，以适用于无铅组装。这种预浸料具有良好的机械性能、热稳定性和化学稳定性，同时还具有良好的防火性能，可以满足无铅组装的要求。

该标准规定了预浸料的物理性能、化学性能、热性能、防火性能等方面的要求。其中，防火性能是该标准的重点之一。预浸料必须通过垂直燃烧测试，以确保其具有良好的防火性能。此外，该标准还规定了预浸料的厚度、树脂含量、玻璃纤维含量等方面的要求。

该标准的实施可以提高印制电路板的质量和可靠性，同时也可以保护环境和人类健康。非卤素预浸料相比于传统的卤素预浸料，具有更好的环保性能，可以减少有害物质的排放，对环境和人类健康的影响更小。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for lead-free assembly
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) for lead-free assembly
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less with improved thermal shock resistance for lead-free assembly
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) with improved thermal shock resistance for lead-free assembly
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less with improved thermal conductivity for lead-free assembly