IEC 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
发布时间：2009-05-26 实施时间：


IEC 61249-4-16:2009 标准是印制电路板制造过程中必不可少的一部分。该标准规定了用于制造多层板的无卤素多功能环氧树脂编织E玻璃预浸料的定义可燃性（垂直燃烧测试）。这种预浸料是一种用于制造印制电路板的材料，它是一种浸渍在玻璃纤维布中的环氧树脂。预浸料在制造印制电路板时起着非常重要的作用，因为它是将电路板的各个层粘合在一起的关键材料。

该标准规定了预浸料的可燃性，即垂直燃烧测试。这个测试是用来确定预浸料在火灾情况下的燃烧性能的。测试结果将决定预浸料是否符合无卤素要求。无卤素要求是指预浸料中不含氯、溴等卤素元素，这些元素在火灾情况下会释放出有毒气体，对人体健康和环境造成危害。

该标准还规定了预浸料的其他性能要求，如导热性、介电常数、耐热性等。这些性能要求是为了确保预浸料在制造印制电路板时能够满足要求，保证电路板的质量和可靠性。

该标准适用于铅-free组装。铅-free组装是指在印制电路板制造过程中不使用含铅焊料，以减少对环境的污染和对人体健康的危害。因此，预浸料必须符合无卤素要求，以满足铅-free组装的要求。

总之，IEC 61249-4-16:2009 标准规定了用于制造多层板的无卤素多功能环氧树脂编织E玻璃预浸料的性能要求，包括可燃性、导热性、介电常数、耐热性等。该标准适用于铅-free组装，以保证印制电路板的质量和可靠性。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/m·K or less for lead-free assembly
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K for lead-free assembly
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K for lead-free assembly with through hole plating
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K for lead-free assembly with copper-clad holes
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/m·K for lead-free assembly with non-plated holes