IEC 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
发布时间:2009-05-26 实施时间:


IEC 61249-4-15:2009 标准是印制电路板制造过程中必不可少的一部分。该标准规定了用于制造多层板的无铅组装用多功能环氧树脂编织E玻璃预浸料的垂直燃烧测试的定义可燃性分规范集。这种预浸料是一种用于制造印制电路板的材料,它是一种浸渍在树脂中的玻璃纤维布。它的主要作用是增强印制电路板的机械强度和电气性能。

该标准规定了预浸料的物理和化学性质,包括其厚度、重量、树脂含量、玻璃纤维含量、垂直燃烧测试、热分解温度等。其中,垂直燃烧测试是预浸料的重要性能指标之一,它可以评估预浸料的可燃性和阻燃性能。该测试是通过将预浸料样品放置在垂直位置,然后点燃其下端,观察其燃烧情况和燃烧时间来评估其可燃性和阻燃性能。

该标准的实施可以保证预浸料的质量和性能,从而保证印制电路板的质量和可靠性。此外,该标准还规定了预浸料的存储和运输条件,以确保其在使用前不会受到损坏或污染。

相关标准
- IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less
- IEC 61249-2-22:2003 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)
- IEC 61249-2-23:2003 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for lead-free assembly
- IEC 61249-2-24:2003 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) for lead-free assembly
- IEC 61249-2-25:2003 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for high-speed and high-frequency applications