印制电路板（PCB）是现代电子设备中不可或缺的组成部分。预浸料是制造PCB的重要材料之一，它是一种预先浸渍了树脂的玻璃纤维布。预浸料在制造PCB时被用来粘合不同层之间的铜箔，形成多层板。高性能预浸料具有更高的机械强度、更好的耐热性和化学稳定性，因此在高端电子设备中得到广泛应用。

IEC 61249-4-18:2013 标准规定了一种高性能环氧树脂编织E玻璃预浸料的定义可燃性（垂直燃烧测试）。该标准要求预浸料在垂直燃烧测试中的燃烧速率不得超过特定的限制，并且在燃烧过程中不得产生有毒气体。这些要求确保了预浸料在使用过程中的安全性和可靠性。

该标准适用于无铅组装。无铅组装是一种环保的电子制造技术，它使用不含铅的焊料，减少了对环境的污染。因此，该标准的发布也反映了电子制造业对环保的重视。

相关标准
- IEC 61249-2-21:2013 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less
- IEC 61249-2-22:2013 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K)
- IEC 61249-2-23:2013 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for lead-free assembly
- IEC 61249-2-24:2013 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) for lead-free assembly
- IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly