随着电子产品的不断发展，印制电路板的应用越来越广泛。预浸料是印制电路板制造过程中的重要材料之一，其质量直接影响到印制电路板的性能和可靠性。IEC 61249-4-19:2013 标准规定了一种无卤高性能环氧树脂预浸料，该预浸料经过垂直燃烧测试，可用于无铅组装。

该标准规定了预浸料的物理、化学和电气性能，包括导电性、介电常数、介电损耗、热膨胀系数、剪切模量等。此外，该标准还规定了预浸料的可燃性要求，即在垂直燃烧测试中，预浸料的燃烧速率和燃烧时间要符合标准要求。

该标准的应用范围包括印制电路板和其他互连结构的材料。该预浸料适用于制造多层板，可用于无铅组装。该预浸料的无卤特性符合环保要求，同时其高性能特性也能满足现代电子产品对印制电路板的高要求。

相关标准
- IEC 61249-2-21:2013 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less for lead-free assembly
- IEC 61249-2-22:2013 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) for lead-free assembly
- IEC 61249-2-23:2013 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less with improved thermal shock resistance for lead-free assembly
- IEC 61249-2-24:2013 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity greater than 1,0 W/(m·K) with improved thermal shock resistance for lead-free assembly
- IEC 61249-2-25:2013 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) or less with improved thermal conductivity for lead-free assembly