IEC 61249-2-44:2016
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间：2016-05-12 实施时间：


印制电路板是现代电子设备中不可或缺的组成部分，而增强基材是印制电路板制造中的重要材料之一。IEC 61249-2-44:2016 标准规定了一种非卤素环氧树脂增强的玻璃纤维增强层压板，用于制造印制电路板和其他互连结构。

该标准规定了该材料的垂直燃烧测试的定义可燃性要求。在垂直燃烧测试中，材料的燃烧速率、燃烧时间和燃烧后的残留物等指标都需要符合标准规定的要求。这些要求旨在确保材料在使用过程中不会对人员和设备造成安全隐患。

此外，该标准还规定了铜覆盖的要求，以适应无铅组装的需要。无铅组装是一种环保的组装方式，但需要使用特殊的铜覆盖材料，以确保焊接质量和可靠性。IEC 61249-2-44:2016 标准规定了铜覆盖的厚度、附着力、耐蚀性等要求，以确保材料在无铅组装中的可靠性。

总之，IEC 61249-2-44:2016 标准规定了一种非卤素环氧树脂增强的玻璃纤维增强层压板，具有良好的可燃性和无铅组装性能，适用于制造印制电路板和其他互连结构。

相关标准
- IEC 61249-2-21:2013 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2013 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-23:2013 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly of through-hole technology circuit boards
- IEC 61249-2-24:2013 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly of surface mount circuit boards
- IEC 61249-2-25:2013 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly of high density interconnection circuit boards