IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间：2018-01-10 实施时间：


印制电路板是现代电子设备中不可或缺的组成部分。增强基材是印制电路板的重要组成部分，它提供了机械强度和稳定性。非卤素环氧树脂玻璃纤维增强层压板是一种常用的增强基材，其具有良好的导热性和可燃性。IEC 61249-2-46:2018 标准规定了这种增强基材的要求和测试方法。

该标准规定了非卤素环氧树脂玻璃纤维增强层压板的导热性应为1.5 W/(m·K)，这是因为导热性是印制电路板中散热的重要因素。此外，该标准还规定了该增强基材的可燃性应符合定义的要求，即在垂直燃烧试验中，火焰前进速度不得超过50 mm/s，燃烧时间不得超过30 s，燃烧后的残留物应符合要求。

铜覆盖是印制电路板中常用的导电层，用于连接电子元件和电路。该标准规定了非卤素环氧树脂玻璃纤维增强层压板应具有铜覆盖，以适用于无铅组装。这是因为无铅组装是现代电子设备中的趋势，而铜覆盖是无铅组装中必不可少的组成部分。

除了上述要求，该标准还规定了非卤素环氧树脂玻璃纤维增强层压板的其他性能指标，如机械强度、耐热性、耐潮性等。此外，该标准还规定了该增强基材的测试方法，以确保其符合要求。

总之，IEC 61249-2-46:2018 标准规定了一种常用的增强基材，即非卤素环氧树脂玻璃纤维增强层压板，其具有良好的导热性和可燃性，适用于印制电路板和其他互连结构的材料。该标准的要求和测试方法有助于保证印制电路板的质量和可靠性。

相关标准
- IEC 61249-2-21:2018 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminate sheets of thermal conductivity 1,3 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2018 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-23:2018 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,8 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-24:2018 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,7 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-25:2018 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,6 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly