IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间：2018-01-10 实施时间：


印制电路板是现代电子设备中不可或缺的组成部分。它们由基材、导电层和保护层组成，用于连接电子元件并传输信号。增强基材是印制电路板的重要组成部分，它提供了机械强度和稳定性，以支持电子元件和连接器。增强基材的性能对印制电路板的质量和可靠性至关重要。

IEC 61249-2-47:2018 标准规定了一种增强基材，即非卤素环氧树脂非织造/织物E玻璃增强层压板。这种增强基材具有高导热性，可提高印制电路板的散热性能。此外，它还具有定义的可燃性，通过垂直燃烧试验进行评估。这种增强基材还具有铜覆盖，适用于无铅组装的印制电路板和其他互连结构。

IEC 61249-2-47:2018 标准的要求适用于制造商和用户。制造商可以使用这个标准来开发和生产高质量的增强基材，以满足客户的需求。用户可以使用这个标准来选择适合其应用的增强基材，并确保其质量和可靠性。

此外，IEC 61249-2-47:2018 标准还规定了增强基材的物理和机械性能、化学性能、热性能、电性能和可燃性能的测试方法。这些测试方法可以确保增强基材符合标准的要求，并具有一致的性能和质量。

相关标准
- IEC 61249-2-21:2018 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2018 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-23:2018 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-24:2018 Materials for printed boards and other interconnecting structures - Part 2-24: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 3,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-25:2018 Materials for printed boards and other interconnecting structures - Part 2-25: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 4,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly