IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
发布时间：2018-01-10 实施时间：


印制电路板是现代电子设备中不可或缺的组成部分。增强基材是印制电路板的重要组成部分，它提供了机械强度和稳定性。IEC 61249-2-45:2018 标准规定了一种增强基材，即非卤素环氧树脂非织造/织造E玻璃增强层压板，其导热性为1.0 W/(m·K)，并具有定义的可燃性（垂直燃烧试验），铜覆盖用于无铅组装的印制电路板和其他互连结构。

该标准要求增强基材必须符合一系列物理、化学和机械性能指标，如厚度、密度、弯曲强度、拉伸强度、剪切强度、热膨胀系数等。此外，增强基材还必须符合可燃性要求，即在垂直燃烧试验中，其燃烧速率和烟雾密度必须符合标准要求。铜覆盖层的厚度和质量也必须符合标准要求，以确保印制电路板的可靠性和稳定性。

非卤素环氧树脂增强基材具有许多优点，如高强度、高温性能、耐化学腐蚀性、耐湿性等。此外，它还具有良好的导热性能，可以有效地散热，提高印制电路板的可靠性和稳定性。铜覆盖层的无铅组装也是现代印制电路板的趋势，可以减少对环境的污染，符合环保要求。

总之，IEC 61249-2-45:2018 标准规定了一种符合要求的增强基材，可以用于无铅组装的印制电路板和其他互连结构。该标准的实施可以提高印制电路板的可靠性和稳定性，同时也符合环保要求。

相关标准
- IEC 61249-2-21:2018 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,8 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-22:2018 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,3 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 0,8 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly, with improved thermal shock resistance
- IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,3 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly, with improved thermal shock resistance
- IEC 61249-2-48:2018 Materials for printed boards and other interconnecting structures - Part 2-48: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly, with improved thermal shock resistance