IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
发布时间:2021-02-03 实施时间:


表面绝缘电阻测试是一种测试电气材料、印制电路板和其他互连结构和组件表面绝缘电阻的方法。表面绝缘电阻测试是一种重要的测试方法,可以用于评估电气材料、印制电路板和其他互连结构和组件的表面绝缘电阻,以确保其符合要求。

IEC 61189-5-502:2021标准规定了表面绝缘电阻测试的方法和要求。该标准要求测试样品必须符合特定的尺寸和形状要求,并且必须在特定的温度和湿度条件下进行测试。测试过程中,测试样品必须暴露在特定的电场下,并且必须在特定的时间内进行测试。

IEC 61189-5-502:2021标准还规定了测试结果的评估方法。测试结果必须符合特定的要求,否则测试样品将被认为不符合要求。如果测试样品不符合要求,必须采取适当的措施来改善其表面绝缘电阻。

总之,IEC 61189-5-502:2021标准是一项非常重要的测试方法标准,可以用于评估电气材料、印制电路板和其他互连结构和组件的表面绝缘电阻,以确保其符合要求。

相关标准
- IEC 61189-5-501:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
- IEC 61189-5-503:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive anodic filament (CAF) testing of materials and assemblies
- IEC 61189-5-504:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Conductive filament (CF) testing of materials and assemblies
- IEC 61189-5-505:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-505: General test methods for materials and assemblies - Electrochemical migration (ECM) testing of materials and assemblies
- IEC 61189-5-506:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - Conductive anodic filament (CAF) testing of printed board and assembly