IEC 61967-4:2002/AMD1:2006标准的主要目的是为了确保集成电路在使用过程中不会对周围环境产生过多的电磁辐射。该标准规定了一种直接耦合法，用于测量集成电路在150 kHz至1 GHz频段内的传导辐射。该方法可以测量集成电路引脚和电源引脚的传导辐射，以及集成电路内部的传导辐射。

该标准要求在测试过程中，集成电路必须处于正常工作状态，并且必须使用适当的测试设备和测试方法。测试设备必须符合IEC 61967-1标准的要求，测试方法必须符合IEC 61967-2标准的要求。测试结果必须符合IEC 61967-3标准的要求。

IEC 61967-4:2002/AMD1:2006标准的实施可以帮助制造商确保其产品符合国际标准的要求，从而提高产品的质量和可靠性。此外，该标准还可以帮助用户选择符合其需求的集成电路产品。

相关标准
- IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
- IEC 61967-2:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
- IEC 61967-3:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method
- IEC 62132-1:2017 Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
- IEC 62132-2:2017 Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method