BS EN IEC 61189-2-809标准规定了使用TMA测定厚基材的X/Y热膨胀系数(CTE)的测试方法。该标准适用于厚度大于或等于0.5mm的基材,如玻璃纤维增强聚酰亚胺(FR-4)和聚四氟乙烯(PTFE)等。该标准的目的是为了评估基材的热膨胀性能,以便在设计和制造印制板和其他互连结构及组件时进行参考。
在测试之前,需要将基材样品切割成符合标准要求的尺寸,并进行表面处理。测试时,需要将样品放置在TMA仪器中,并根据标准要求设置温度范围和升温速率。在测试过程中,TMA仪器会测量样品的长度变化,从而计算出X/Y热膨胀系数。
该标准还规定了测试结果的计算方法和报告要求。测试结果应该包括样品的尺寸、温度范围、升温速率、X/Y热膨胀系数等信息,并应该注明测试方法和仪器型号。
BS EN IEC 61189-2-809标准的实施可以帮助制造商评估基材的热膨胀性能,从而更好地设计和制造印制板和其他互连结构及组件。此外,该标准还可以帮助用户选择合适的基材,以满足其特定的应用需求。
相关标准
- BS EN IEC 61189-2-811. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-811: TMA test method for the determination of the z-axis coefficient of thermal expansion (CTE) of thin materials
- BS EN IEC 61189-2-812. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-812: TMA test method for the determination of the z-axis coefficient of thermal expansion (CTE) of thick materials
- BS EN IEC 61189-2-813. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-813: TMA test method for the determination of the z-axis coefficient of thermal expansion (CTE) of prepreg
- BS EN IEC 61189-2-814. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-814: TMA test method for the determination of the z-axis coefficient of thermal expansion (CTE) of copper-clad laminates
- BS EN IEC 61189-2-815. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-815: TMA test method for the determination of the z-axis coefficient of thermal expansion (CTE) of solder mask and overlay materials